bonding pressure的意思|示意

Although the interface has the features of melt, and pressure welding, the molten and diffusion welding cannot explain the bonding mechanism of explosive welding.

实验表明，爆炸焊接界面虽然具有熔化、扩散和压力焊的特征，但不能用熔焊和扩散焊机理来解释爆炸焊接界面的成因。

The experiment showed that only when the bonding pressure in a moderate conditions can the largest bonding strength be reached.

实验发现，只有在键合压力适中的情况下，键合强度才能达到最大。

In process parameters, the rf power and pressure affect the number, energy and composition of the basic elements, the substrate temperature effect the surface diffusion and atomic bonding.

工艺参数中，射频功率和压强综合影响了基元数量、能量以及成分，基片温度主要影响表面扩散、原子成键。

Good quality andhigh efficiency: continuous bonding operation, high production efficiency, strong spring pressure, after bonding cloth smooth and firm and washing, nowrinkle.

品质好效率高：连续粘接式作业，生产效率高，强力弹簧加压，粘合后的衣料平整牢固，而洗涤，不易起皱。

Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.

从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。

The article analyzed the relations between the bonding pressure and the bonding strength through the experiment.

通过实验，研究了键合强度与键合压力间的关系。