Wafer Level Package的意思|示意
Wafer Level Package的网络常见释义
晶圆级封装 晶圆级封装(Wafer Level Package,WLP),是一 项先进封装技术,形成封装体的各..
晶圆尺寸封装 Wafer Level Package(晶圆尺寸封装)： 39 CSP封装所涉及之精密技术:Flip Chip • Flip Chip(覆晶 ):覆晶技术起源于1960年代，当时IBM 开发出所谓之C4 (Controlled C...
圆片级封装 ...、低成本化的发展趋势之下，随着圆片的再配线及凸块加工费用的降低，以及安装成奉的降低，WLP圆片级封装（Wafer Level Package，WLP）以及DCA直接芯片安装（Direct Chip Attach，DCA）的应用将会更广泛开展起来。
Wafer Level Package相关短语
1、 Fan-out Wafer Level Package 扇出型晶圆级封装
2、 wafer level package dielectrics 晶圆级封装介质
3、 wafer level package wlp 圆片级封装
Wafer Level Package相关例句
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
They can be classified into wafer level, chip level, and package level stacking.
它们可以分为圆片级封装、芯片级封装、和封装面。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.
在完成整体结构圆片级真空封装的同时通过引线腔结构方便地实现了中间电极的引线。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。