Solder paste printing的意思|示意

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锡膏印刷


Solder paste printing的网络常见释义

锡膏印刷 HIP-焊球大小不一 锡膏印刷(Solder paste printing)。锡膏印刷于焊垫上面的锡膏量多寡不一,或是电路板上有所谓的导通孔在垫(Vias-in-pad),就会造成锡膏无法接触到焊球的可能性,并...

如何将锡膏印刷于电路板 ... Glue & Ink, Process(制程) 人气(71,834)   回响(63) Conformal Coating, 影片 如何将锡膏印刷于电路板(solder paste printing) Posted by 工作熊 八月 4, 2011 将锡膏(solder paste)印刷于电路板再经过回焊炉(reflow)连接电子零件于电路板上,是现今电子制 ...

印锡浆 ...the CK code on the PCB surface ) 贴装元件 (surface mounting ) 回流焊 (reflow oven ) 印锡浆 (solder paste printing ) 清洁 PCB 并写上CK代码 ( Clean PCB and stamp the CK code on the PCB surface ) 回流焊 (reflow oven ) FQC 100% 全检 ...

印刷锡膏 进板25PCB正在被推出料架, 推向印刷机自动推杆 印刷锡膏(Solder Paste Printing)-126钢网(stencil) 印刷锡膏(Solder Paste Printing)-227 印刷示意图刮刀SolderSolder PrinterPrinter内部工作内部工作示示意图...

Solder paste printing相关短语

1、 solder paste printing process 锡膏印刷

2、 simulation of solder paste printing 焊膏印刷模拟

3、 Solder Paste Printing-Stencil & Screen 锡膏印刷

Solder paste printing相关例句

Introduce many factors of infecting quality in solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.

介绍焊膏印刷中影响质量的诸多因素并分析其原因,同时提出部分纠正措施和建议。

Solder paste, screen printing, use ways, printing process course will decide the printing quality.

在锡膏印刷工艺中,锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量。

It specifies the influence of the parameters of solder paste printing, printing cycle, ease operation of software and additional steps of cleaning and inspection on improving the quality of products.

阐述了锡膏印刷工艺参数,印刷周期,操作软件的易用性,以及清洗、检验等附加工序对实际生产量的影响。

It is believed that JetPrinting will more be adopted in electronics assembly, and will also be a competitive solder-paste printing technology.

可以确信焊膏喷印将会被更多地应用于电子组装上,成为一种具有竞争力的焊膏印刷技术。

Squeegee Bodyguard can thoroughly clean your squeegees and return a clean and tidy printing environment to you. Occurrences of solder paste pollution and steel mesh blocking will be greatly lowered.

刮刀卫士,彻底清洗你的刮刀,还你一个清洁、干净的印刷环境,锡膏污染、钢网堵塞问题大大降低了。

This article introduces the process of solder paste technical printing, analyses the interrelated disfigurement in printing and cause, and puts forward the relevant solvent.

本文简述了锡膏印刷的工艺流程,分析印刷过程中造成的相关缺陷及其产生的原因,并提出了相应的解决方法。