Soft Pad Polishing的意思|示意
软垫抛光
Soft Pad Polishing的网络常见释义
软垫研磨 软垫研磨(Soft Pad Polishing)是一项使工件(欲加工的..
Soft Pad Polishing相关短语
1、 soft polishing pad 软磨片
Soft Pad Polishing相关例句
Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
The polishing pad can be used for polishing and processing various thin workpieces, is particularly suitable for thermal sensitivity materials, soft material, crystal materials, and the like.
该抛光垫可用于抛光加工各种薄形工件，尤其适于加工热敏性材料、软材料、晶体材料等。