IC Lead Frame的意思|示意
IC引线框
IC Lead Frame的网络常见释义
及积体线路导线架 ...essed by Thin-Film Transistors) 导线架（Lead Frame） 单体导线架（Discrete Lead Frame）及积体线路导线架 （IC Lead Frame）二种 ISP (Internet Service Provider) 指的是网际网络服务提供 ADSL 即为非对称数字用户回路调制解调器 SOP Standard Operation...
导线架 ...线切割放电加工控制技术 近年来由于产业对高精密与微小模具需求趋势增加，如半导体产业所使用之IC导线架(IC Lead Frame)，其加工特性为最小尺寸误差必须在2μm内；如IT产业之微连接器；如钟表工业所使用之齿轮零件；如生物医学用之感测元件(Sensor Co...
框架 例如合金制品业，如积体电路框架(IC lead frame)、光罩(photo mask)、厚膜 印刷纲板(thickfilm screen)的制造产业等。
IC Lead Frame相关短语
1、 ic-lead frame 集成电路引线框架
IC Lead Frame相关例句
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure.
介绍了IC引线框架级进冲模的特点并着重讲述了其排样设计中的整形工位和模具结构中的卸料、微调和安全机构，可供精密级进冲模设计参考。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
Copper alloys for lead frame are becoming leading factor in the lead frame materials for IC, because of its high strength and high conductivity.
铜合金引线框架材料因其高强高导电性能而成为集成电路框架材料的主体。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。